Download Atomic Layer Deposition: Principles, Characteristics, and by Tommi Kaariainen, David Cameron, Marja?Leena Kaariainen, PDF

By Tommi Kaariainen, David Cameron, Marja?Leena Kaariainen, Arthur Sherman(auth.)

Because the first version was once released in 2008, Atomic Layer Deposition (ALD) has emerged as a strong, and occasionally most well liked, deposition know-how. the recent version of this groundbreaking monograph is the 1st textual content to check the topic of ALD comprehensively from a pragmatic viewpoint. It covers ALD's software to microelectronics (MEMS) and nanotechnology; many very important new and rising functions; thermal procedures for ALD development of nanometer thick movies of semiconductors, oxides, metals and nitrides; and the formation of natural and hybrid materials.Content:
Chapter 1 basics of Atomic Layer Deposition (pages 1–31):
Chapter 2 Elemental Semiconductor Epitaxial motion pictures (pages 33–49):
Chapter three III?V Semiconductor motion pictures (pages 51–66):
Chapter four Oxide motion pictures (pages 67–159):
Chapter five Nitrides and different Compounds (pages 161–182):
Chapter 6 Metals (pages 183–206):
Chapter 7 natural and Hybrid fabrics (pages 207–213):
Chapter eight ALD functions and (pages 215–242):

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Extra info for Atomic Layer Deposition: Principles, Characteristics, and Nanotechnology Applications, Second Edition

Sample text

6b, the plasma is generated by capacitive coupling. 56 MHz). In the direct plasma configuration one electrode is powered and the other one, where the substrate is also positioned, is grounded. Since the distance between the plasma source and the substrate in this type of configuration is small, it can result in very high fluxes of radicals and other plasma species towards the substrate surface. Consequently it allows the reduction of plasma exposure time and the design is amenable also to large area deposition.

Both precursors were delivered in a hydrogen carrier gas at 500 sccm flow rates, at a pressure of one atmosphere. Single crystal GaAs was grown by this technique as evidenced by transmission electron diffraction patterns [4]. 4. Similarly, growth rates were independent of arsine flow and substrate temperature within the range of 450–700°C. Depositions were carried out on (100) and (111)B GaAs crystal orientations. 1 [3].

Mahajan, J. Irby, D. Kinosky, R. Qian, S. Thomas, S. Banerjee, A. Tasch and T. Picraux, Si atomic layer epitaxy based on Si2H6 and remote He plasma bombardment, 177 © (1993), American Vacuum Society. Elemental Semiconductor Epitaxial Films 45 3 Growth rate (Å/cycle) Growth rate (Å/cycle) The He bombardment was continued for 2–3 min. per cycle. Although good quality epitaxial silicon was grown, by an ALD process, the growth rate was less than the desired 1 ML/cycle. The demonstration that energetic He atoms can remove adsorbed hydrogen at low temperatures is significant.

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